MIC5200 datasheet(5/24 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

DS20005578A-page 5

MIC5200

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature

Range

–40

—

+125

°C

Note 1

Lead Temperature

—

+260

°C

Soldering, 5s

Package Thermal Resistances

Thermal Resistance, SOT-223

JC

—15

—

°C/W

—

Thermal Resistance, SOIC-8

JA

—160

—

°C/W

Note 2

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

The maximum allowable power dissipation at any ambient temperature is calculated using: P(MAX) =

(TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die tem-

perature, and the regulator will go into thermal shutdown. The θJC of the MIC5200-x.xYS is 15°C/W and

θJA for the MIC5200YM is 160°C/W mounted on a PC board (see Thermal Considerations for further

details).

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