IS1871 datasheet(27/44 Pages) MICROCHIP

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 2015-2016 Microchip Technology Inc.

DS60001371C-Page 27

IS1870/71

5.0

REFLOW PROFILE AND

STORAGE CONDITION

Figure 5-1 and Figure 5-2 illustrate reflow profiles and

stencil information of the IS1870/71 SoC.

5.1

Stencil of SMT Assembly

Suggestion

5.1.1

STENCIL TYPE & THICKNESS

• Laser cutting

• Stainless steel

• Thickness: 0.5 mm pitch, thickness < 0.15 mm

5.1.2

APERTURE SIZE AND SHAPE FOR

TERMINAL PAD

• Aspect ratio (width/thickness) >1.5

• Aperture shape

- The stencil aperture is designed to match the

pad size on the PCB.

- Oval-shape opening should be used to get

the optimum paste release.

- Rounded corners to minimize clogging.

- Positive taper walls (5

° tapering) with bottom

opening larger than the top.

5.1.3

APERTURE DESIGN FOR THERMAL

PAD

• Small multiple openings should be used instead

of one big opening.

• 60~80% solder paste coverage

• Rounded corners to minimize clogging

• Positive taper walls (5° tapering) with bottom

opening larger than the top

FIGURE 5-1:

REFLOW PROFILE

FIGURE 5-2:

STENCIL TYPE

Do not recommend

Recommend

Coverage 91%

Coverage 77%

Coverage 65%

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