LM3886 datasheet(13/20 Pages) NSC

13 / 20 page

Application Information (Continued)

Over-Voltage Protection: The LM3886 contains overvolt-

age protection circuitry that limits the output current to ap-

proximately 11Apeak while also providing voltage clamping,

though not through internal clamping diodes. The clamping

effect is quite the same, however, the output transistors are

designed to work alternately by sinking large current spikes.

SPiKe Protection: The LM3886 is protected from instanta-

neous peak-temperature stressing by the power transistor

array. The Safe Operating Area graph in the Typical Perfor-

mance Characteristics section shows the area of device

operation where the SPiKe Protection Circuitry is not en-

abled. The waveform to the right of the SOA graph exempli-

fies how the dynamic protection will cause waveform distor-

tion when enabled.

Thermal Protection: The LM3886 has a sophisticated ther-

mal protection scheme to prevent long-term thermal stress

to the device. When the temperature on the die reaches

165˚C, the LM3886 shuts down. It starts operating again

when the die temperature drops to about 155˚C, but if the

temperature again begins to rise, shutdown will occur again

at 165˚C. Therefore the device is allowed to heat up to a

relatively high temperature if the fault condition is temporary,

but a sustained fault will cause the device to cycle in a

Schmitt Trigger fashion between the thermal shutdown tem-

perature limits of 165˚C and 155˚C. This greatly reduces the

stress imposed on the IC by thermal cycling, which in turn

improves its reliability under sustained fault conditions.

Since the die temperature is directly dependent upon the

heat sink, the heat sink should be chosen as discussed in

the Thermal Considerations section, such that thermal

shutdown will not be reached during normal operation. Using

the best heat sink possible within the cost and space con-

straints of the system will improve the long-term reliability of

any power semiconductor device.

THERMAL CONSIDERATIONS

Heat Sinking

The choice of a heat sink for a high-power audio amplifier is

made entirely to keep the die temperature at a level such

that the thermal protection circuitry does not operate under

normal circumstances. The heat sink should be chosen to

dissipate the maximum IC power for a given supply voltage

and rated load.

With high-power pulses of longer duration than 100 ms, the

case temperature will heat up drastically without the use of a

heat sink. Therefore the case temperature, as measured at

the center of the package bottom, is entirely dependent on

heat sink design and the mounting of the IC to the heat sink.

For the design of a heat sink for your audio amplifier applica-

tion refer to the Determining The Correct Heat Sink sec-

tion.

Since a semiconductor manufacturer has no control over

which heat sink is used in a particular amplifier design, we

can only inform the system designer of the parameters and

the method needed in the determination of a heat sink. With

this in mind, the system designer must choose his supply

voltages, a rated load, a desired output power level, and

know the ambient temperature surrounding the device.

These parameters are in addition to knowing the maximum

junction temperature and the thermal resistance of the IC,

both of which are provided by National Semiconductor.

As a benefit to the system designer we have provided Maxi-

mum Power Dissipation vs Supply Voltages curves for vari-

ous loads in the Typical Performance Characteristics sec-

tion, giving an accurate figure for the maximum thermal

resistance required for a particular amplifier design. This

data was based on

JC = 1˚C/W and θCS = 0.2˚C/W. We also

provide a section regarding heat sink determination for any

audio amplifier design where

CS may be a different value. It

should be noted that the idea behind dissipating the maxi-

mum power within the IC is to provide the device with a low

resistance to convection heat transfer such as a heat sink.

Therefore, it is necessary for the system designer to be con-

servative in his heat sink calculations. As a rule, the lower

the thermal resistance of the heat sink the higher the amount

of power that may be dissipated. This is of course guided by

the cost and size requirements of the system. Convection

cooling heat sinks are available commercially, and their

manufacturers should be consulted for ratings.

Proper mounting of the IC is required to minimize the thermal

drop between the package and the heat sink. The heat sink

must also have enough metal under the package to conduct

heat from the center of the package bottom to the fins with-

out excessive temperature drop.

A thermal grease such as Wakefield type 120 or Thermalloy

Thermacote should be used when mounting the package to

the heat sink. Without this compound, thermal resistance will

be no better than 0.5˚C/W, and probably much worse. With

the compound, thermal resistance will be 0.2˚C/W or less,

assuming under 0.005 inch combined flatness runout for the

package and heat sink. Proper torquing of the mounting

bolts is important and can be determined from heat sink

manufacturer’s specification sheets.

Should it be necessary to isolate V− from the heat sink, an in-

sulating washer is required. Hard washers like beryluum ox-

ide, anodized aluminum and mica require the use of thermal

compound on both faces. Two-mil mica washers are most

common, giving about 0.4˚C/W interface resistance with the

compound.

Silicone-rubber washers are also available. A 0.5˚C/W ther-

mal resistance is claimed without thermal compound. Expe-

rience has shown that these rubber washers deteriorate and

must be replaced should the IC be dismounted.

Determining Maximum Power Dissipation

Power dissipation within the integrated circuit package is a

very important parameter requiring a thorough understand-

ing if optimum power output is to be obtained. An incorrect

maximum power dissipation (P

D) calculation may result in in-

adequate heat sinking, causing thermal shutdown circuitry to

operate and limit the output power.

The following equations can be used to acccurately calculate

the maximum and average integrated circuit power dissipa-

tion for your amplifier design, given the supply voltage, rated

load, and output power. These equations can be directly ap-

plied to the Power Dissipation vs Output Power curves in the

Typical Performance Characteristics section.

Equation (1) exemplifies the maximum power dissipation of

the IC and

Equations (2), (3) exemplify the average IC power

dissipation expressed in different forms.

DMAX = VCC2/2π

(1)

where V

CC is the total supply voltage

DAVE = (VOpk/RL)[VCC/π −VOpk/2]

(2)

where V

CC is the total supply voltage and VOpk = VCC/π

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