(Ver 1.0)

10/14

(4) Soldering Conditions

• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any

guarantee on the LEDs after they have been assembled using the dip soldering method.

• Recommended soldering conditions

Reflow Soldering

Hand Soldering

pre-heat

pre-heat time

peak temperature

soldering time

condition

Lead Solder

Lead-free Solder

temperature

soldering time

350℃ max

3sec max

(one time only)

120~150℃

120sec max

240℃ max

10sec max

refer to profile ①

200~220℃

120sec max

260℃ max

5sec max

refer to profile ②

* After reflow soldering, rapid cooling should be avoided.

[temperature-profile (surface of circuit board)]

Use the conditions shown to the following figures.

<① : Lead Solder>

<② : Lead-free Solder>

Time [sec]

3~5℃/sec

260℃ Max

5sec Max

45sec

Max

Pre-heating

200~220℃

1~5℃/sec

120sec Max

Room Temp

T

e

m

p

℃

Time [sec]

2~3℃/sec

240℃ Max

10sec Max

60sec

Max

Pre-heating

120~150℃

2~5℃/sec

120sec Max

Room Temp

T

e

m

p

℃