1

2015.4

Features

1. Allows for direct soldering of wires to the PCB

The MDF12 and MDF27 eliminates the traditional

crimp housing/receptacle combination by crimping

the contact on to the wire and then directly soldering

it to the PCB. This improves assembly times and

connection reliability.

Has temporary PCB hold retention ability which allows

for easier soldering and helps to reduces labor costs.

The contact crimps both around the center

conductor and the jacket. The jacket crimp prevents

breakage or damage to the center conductor at the

solder joint by transferring stress to the jacket

portion of the terminated wire.

2. Vertical and right angle versions

The MDF12 contact is designed for when a vertical

connection to the PCB is needed. Please use the

MDF27 contact for applications that require a right

angle orientation

.

3. Supports larger gauge wires and higher

current ratings

The MDF12 and MDF27 can be used with wire diameters

ranging from 22 to 14 AWG and provides for a current

capacity of up to 15 A when using 14 AWG.

Contacts are suitable for use with readily available

UL1007 and UL1015 wire types.

Product specifications

Rated value

Rated current

(Note 1)

14 AWG : 15A

16 AWG : 10A

18 AWG : 9A

20 AWG : 5A

22 AWG : 5A

Operating temperature range

Operating humidity range

-35 to 85 ç (Note 2)

20 to 80 %

Rated voltage

300V AC

Storage temperature range

Storage humidity range

-10 to 60 ç (Note 3)

40 to 70 % (Note 3)

Items

Specifications

Conditions

1. Crimp Contact

resistance

15 mø min.

Measured at 100 mA

2. Vibration

resistance

No damaged or loosened parts.

Frequency: 10 to 55 Hz; half amplitude: 0.75 mm,

in 3 directions for 2 hours

3. Moisture

resistance

No damaged or loosened parts.

Left for 96 hours at a temperature of 40 ç ±2 ç and with

humidity of 90 to 95 %

4. Temperature

cycle

No damaged or loosened parts.

(-55 ç for 30 minutes→ 5 to 35 ç for 10 minutes→ 85 ç

for 30 minutes→ 5 to 35 ç for 10 minutes) in 5 cycles

for 5 cycles

5. Solder heat

resistance

No loosening affecting the performance.

Flow: 250 ç for

10 seconds

Hand soldering: soldering iron

temperature 300 ç for 3 seconds

Note 1: The rated current differs depending on the wire size used.

Note 2: Includes the temperature rise when energized.

Note 3: Storage described here indicates the long-term-storage of unused items before they are mounted on PCB.

Operating humidity range applies to the non-energized state after the items are mounted on PCB.

Material

Product

Component

Material

Finish

Crimping contact

Contact

Brass

Tin plating

Note: Our tin plating process helps prevent whiskering.

MDF12/27 Series

Crimp Contact for Direct Joining Thick Wire PCB

Thick Wire Crimp Contact for Direct Soldering to PCB