DATA SHEET

SEMICONDUCTOR

http://www.yeashin.com

1

REV.02 20130927

GL2500 THRU GL2510

FEATURES

• Plastic Case With Heatsink For Heat Dissipation.

• The plastic package has Underwriters

Laboratory Flammability Classification 94V-O

• Pb free product are available : 99% Sn can meet Rohs environment

substance directive request

IN-LINE HIGH CURRENT SILICON BRIDGE RECTIFIER

1.130(28.7)

.450(11.23)

.142(3.60)

1.118(28.4)

.431(10.97)

.120(3.06)

.047(1.2)

.20(5.08)MIN.

MECHANICALDATA

Case: Molded plastic with heatsink integrally mounted in birdge encapsulation.

Weight: 1.0 ounce, 30 gram

Terminals: Wire Lead o 50 mils

Mounting Position: Any

MAXIMUM RATINGSAND ELECTRICALCHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz, Resistive or inductive load.

For capacitive load, derate current by 20%

R

E

T

E

M

A

R

A

PL

O

B

M

Y

S0

0

5

2

L

G1

0

5

2

L

G2

0

5

2

L

G4

0

5

2

L

G6

0

5

2

L

G8

0

5

2

L

G

T

I

N

U

e

g

a

t

l

o

V

e

s

r

e

v

e

R

k

a

e

P

t

n

e

r

r

u

c

e

R

m

u

m

i

x

a

M

0

50

0

10

0

20

0

40

0

60

0

8

e

g

a

t

l

o

V

S

M

R

m

u

m

i

x

a

M

5

30

70

4

10

8

20

2

40

6

5

e

g

a

t

l

o

V

g

n

i

k

c

o

l

B

C

D

m

u

m

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a

M

0

50

0

10

0

20

0

40

0

60

0

8

d

a

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L

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v

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t

s

i

s

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R

r

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f

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r

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C

d

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a

w

r

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F

e

g

a

r

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v

A

m

u

m

i

x

a

M

T

t

a

c

5

5

=

0

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5

2

d

a

o

L

d

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a

R

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a

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n

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r

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C

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S

d

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w

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F

k

a

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P

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v

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p

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r

-

n

o

N

0

0

3

A

5

.

2

1

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a

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m

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l

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e

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d

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r

B

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V

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F

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C

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f

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1

.

1

T

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d

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m

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5

2

=

T

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a

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V

g

n

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k

c

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B

C

D

A

0

0

1

=

0

1

0

0

0

1

µA

)

s

m

5

3

.

8

<

t

(

g

n

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f

r

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f

g

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a

R

T

7

3

2

C

E

S

g

e

l

r

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p

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c

n

a

t

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i

s

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R

l

a

m

r

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h

T

l

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p

y

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θ C

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2

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W

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a

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p

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0

5

1

+

O

T

0

5

-

.201(5.1)

.201(5.1)

.201(5.1)

S

V

V

V

A

A

V

A

10

5

2

L

G

000

1

00

7

000

1

Surge overload rating: 300 Amperes peak

NOTES: 1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

2.Device mounted on 300mm*300mm*1.6mm Cu plate heatsink.

(with heatsink Note 2)