High Power PIN Diodes

V16

MA4P MELF & HIPAX Series

11

11

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

11

Ordering Information

MELF diodes are available in tape and reel in quantities as shown in table below

Package Style

Quantity (7” Reel)

Bulk Devices Per Bag

1072T

1500 or 5000

N/A

1091T

500

N/A

MELF Assembly Recommendations

Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable

surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.

For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the MACOM website.

Dimension

Package Style

1091

1072

inches

mm

inches

mm

A

0.093

2.36

0.150

3.81

B

0.050

1.27

0.050

1.27

C

0.060

1.52

0.100

2.54

B

B

C

A

Circuit Pad Layout for MELF Diodes

MELF Internal Construction

Tape and reel information can be found in application note M513 the MACOM website.