LM4819LD datasheet(4/21 Pages) NSC

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Electrical Characteristics V

DD =3V (Notes 2, 3)

The following specifications apply for V

DD = 3V and RL =16Ω load unless otherwise stated. Limits apply to TA =

25˚C. (Continued)

Note 1: See AN-450 ’Surface Mounting and their Effects on Product Reliability’ for other methods of soldering surface mount devices.

Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 3:

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits.

Electrical Characteristics state DC and AC electrical specifications under particular test conditions which

guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit

is given. However, the typical value is a good indication of device’s performance.

Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX =(TJMAX–TA)/θJA. For the LM4819, TJMAX = 150˚C and the typical junction-to-ambient thermal resistance (θJA) when board

mounted is 210˚C/W for the MSOP package and 170˚C/W for the SOP package.

Note 5: Human body model, 100pF discharged through a 1.5 k

Ω resistor.

Note 6: Machine Model, 220pF–240pF capacitor is discharged through all pins.

Note 7: Typical specifications are specified at 25˚C and represent the parametric norm.

Note 8: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 9: Datasheet min/max specification limits are guaranteed by designs, test, or statistical analysis.

Note 10: The given

JA is for an LM4819 package in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to

that of the Exposed-DAP itself. The Exposed-DAP of the LDA08B package should be electrically connected to GND or an electrically isolated copper area.

Note 11: The given

θJA is for an LM4819 package in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.

Note 12: The shutdown pin (pin1) should be driven as close as possible to VDD for minimum current in Shutdown Mode.

External Components Description (Figure 1)

Components

Functional Description

Combined with R

f, this inverting input resistor sets the closed-loop gain. Ri also forms a high pass filter with

i at fc = 1/(2πRiCi).

This input coupling capacitor blocks DC voltage at the amplifier’s terminals. Combined with R

i, it creates a

high pass filter with R

i at fc = 1/(2πRiCi). Refer to the section, Proper Selection of External Components

for an explanation of how to determine the value of C

Combined with R

i, this is the feedback resistor that sets the closed-loop gain: Av = 2(RF/Ri).

This is the power supply bypass capacitor that filters the voltage applied to the power supply pin. Refer to

the Application Information section for proper placement and selection of C

This is the bypass pin capacitor that filters the voltage at the BYPASS pin. Refer to the section, Proper

Selection of External Components, for information concerning proper placement and selection of C

Typical Performance Characteristics

THD+N vs Frequency

DS200136-37

THD+N vs Frequency

DS200136-38

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