Data Sheet G14983EJ3V0DS

10

µµµµPC2918, 2925, 2926

RECOMMENDED SOLDERING CONDITIONS

The

µPC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact our sales representative.

Type of Surface Mount Device

µµµµPC2918T, µµµµPC2925T, µµµµPC2926T: MP-3Z(SC-63)

Process

Conditions

Symbol

Infrared Ray Reflow

Peak temperature: 235°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 3 times or less.

IR35-00-3

Vapor Phase Soldering

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 3 times or less.

VP15-00-3

Wave Soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

WS60-00-1

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

–

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

Type of Through-hole Device

µµµµPC2918HB, µµµµPC2925HB, µµµµPC2926HB: MP-3(SC-64)

Process

Conditions

Wave Soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

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