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LM4840 Datasheet(PDF) 11 Page - National Semiconductor (TI) |
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LM4840 Datasheet(HTML) 11 Page - National Semiconductor (TI) |
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11 / 19 page ![]() Application Information (Continued) level without forced air cooling. In all circumstances and conditions, the junction temperature must be held below 150˚C to prevent activating the LM4840’s thermal shutdown protection. The LM4840’s power derating curve in the Typi- cal Performance Characteristics shows the maximum power dissipation versus temperature. Further detailed and specific information concerning PCB layout, fabrication, and mounting an LQ (LLP) package is available in National Semiconductor’s AN1187. POWER DISSIPATION Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified load. P DMAX =(VDD) 2/(2 π 2R L) (1) However, a direct consequence of the increased power de- livered to the load by a bridged amplifier is an increase in internal power dissipation. Equation 2 states the maximum power dissipation point for a bridged amplifier operating at a given supply voltage and driving a specified load. P DMAX = 4(VDD) 2/(2 π 2R L) (2) Since theLM4840 is a stereo power amplifier, the maximum internal power dissipation is two times that of Equation 1 or Equation 2 depending on the mode of operation. Even with the power dissipation of the stereo amplifiers, the LM4840 does not require heatsinking. The power dissipation from the amplifiers, must not be greater than the package power dissipation that results from Equation 3: P DMAX =(TJMAX −TA)/ θ JA (3) For the LM4840 TSSOP package, θ JA = 80˚C/W and TJMAX = 150˚C. Depending on the ambient temperature, T A,ofthe system surroundings, Equation 3 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 1 and 2 is greater than that of Equation 3, then either the supply voltage must be decreased, the load impedance increased, or the ambient temperature reduced. For the typical application of a 5V power supply, with an 8 Ω bridged loads, the maximum am- bient temperature possible without violating the maximum junction temperature is approximately 48˚C provided that device operation is around the maximum power dissipation points. Power dissipation is a function of output power and thus, if typical operation is not around the maximum power dissipation point, the ambient temperature can be increased. Refer to the Typical Performance Characteristics curves for power dissipation information for different output powers. LAYOUT As stated in the Grounding section, placement of ground return lines is imperative in maintaining the highest level of system performance. It is not only important to route the correct ground return lines together, but also to be aware of where the ground return lines are routed with respect to each other. The output load ground returns should be physically located as far as possible from low signal level lines and their ground return lines. 3 Ω and 4Ω Layout Considerations With low impedance loads, the output power at the loads is heavily dependent on trace resistance from the output pins of the LM4840. Traces from the output of the LM4840MH to the load or load connectors should be as wide as practical. Any resistance in the output traces will reduce the power delivered to the load. For example, with a 4 Ω load and 0.1Ω of trace resistance in each output, output power at the load drops from 2W to 1.8W. Output power is also dependent on supply regulation. To keep the supply voltage from sagging under full output con- ditions, the supply traces should be as wide as practical. Grounding In order to achieve the best possible performance, there are certain grounding techniques to be followed. All input refer- ence grounds should be tied with their respective source grounds and brought back to the power supply ground sepa- rately from the output load ground returns. Bringing the ground returns for the output loads back to the supply sepa- rately will keep large signal currents from interfering with the stable AC input ground references. The exposed-DAP of the LM4840MH package must be tied to ground. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as possible. The effect of a larger half supply bypass capacitor is improved PSRR due to increased half-supply stability. Typical applications employ a 5 volt regulator with 10 µF and a 0.1 µF bypass capacitors which aid in supply stability, but do not eliminate the need for bypassing the supply nodes of the LM4840. The selection of bypass capacitors, especially C B , is thus dependant upon desired PSRR requirements, click and pop performance as explained in the section, Proper Selection of External Components, system cost, and size constraints. It is also recommended to decouple each of the V DD pins with a 0.1µF capacitor to ground. PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components in applications us- ing integrated power amplifiers is critical to optimize device and system performance. While the LM4840 is tolerant of external component combinations, consideration to compo- nent values must be used to maximize overall system qual- ity. The LM4840’s bridged amplifier should be used in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1Vrms are available from sources such as audio codecs. Besides gain, one of the major considerations is the closed- loop bandwidth of the amplifier. To a large extent, the band- width is dictated by the choice of external components. Both the input coupling capacitor, C I, and the output coupling capacitor form first order high pass filters which limit low frequency response given in Equations 4 and 5. f IC = 1/(2πRiCi) (4) f OC = 1/(2πRLCO) (5) These values should be chosen based on required fre- quency response. Selection of Input and Output Capacitor Size Large input and output capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized capacitor is needed to couple in low frequencies without www.national.com 11 |
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