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LM4863M Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM4863M
Description  Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
PDF  16 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM4863M Datasheet(HTML) 5 Page - National Semiconductor (TI)

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External Components Description
(
Figure 1 )
Components
Functional Description
1.
R
i
Inverting input resistance which sets the closed-loop gain in conjunction with R
f. This resistor also forms a
high pass filter with C
i at fc = 1/(2πRiCi).
2.
C
i
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i at fc = 1/(2πRiCi). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of C
i.
3.
R
f
Feedback resistance which sets the closed-loop gain in conjunction with R
i.
4.
C
s
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5.
C
B
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of
External Components, for information concerning proper placement and selection of C
B.
Typical Performance Characteristics
MTE Specific Characteristics
Note 16: These curves show the thermal dissipation ability of the LM4863MTE at different ambient temperatures given these conditions:
500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + 2.5in2: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2.5in2: The part is soldered to a 2.5in2, 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
LM4863MTE
THD+N vs Output Power
DS012881-97
LM4863MTE
THD+N vs Frequency
DS012881-99
LM4863MTE
THD+N vs Output Power
DS012881-96
LM4863MTE
THD+N vs Frequency
DS012881-98
LM4863MTE
Power Dissipation vs Power Output
DS012881-90
LM4863MTE(Note 16)
Power Derating Curve
DS012881-95
www.national.com
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