2

2 - 17

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND

3. BOND PADS ARE 0.004 (0.100) SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

Collector Bias Voltage (Vcc)

+7 Vdc

RF Input Power (RFIN)(Vcc = +5 Vdc)

+10 dBm

Junction Temperature

150 °C

Continuous Pdiss (T= 85 °C)

(derate 5.21 mW/°C above 85 °C)

0.339 W

Thermal Resistance

(junction to die bottom)

192 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Standard

Alternate

GP-3 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC397

v03.0109

InGaP HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 10 GHz

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

For price, delivery, and to place orders: Analog Devices, Inc.,

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D