October 1999

2

Rev 1.200

Philips Semiconductors

Product specification

PSMN005-55B;

PSMN005-55P

FEATURES

SYMBOL

QUICK REFERENCE DATA

• ’Trench’ technology

V

• Very low on-state resistance

• Fast switching

I

• Low thermal resistance

R

R

GENERAL DESCRIPTION

SiliconMAX products use the latest Philips Trench technology to achieve the lowest possible on-state resistance in

each package at each voltage rating.

Applications:-

• d.c. to d.c. converters

• switched mode power supplies

The PSMN005-55P is supplied in the SOT78 (TO220AB) conventional leaded package.

The PSMN005-55B is supplied in the SOT404 surface mounting package.

PINNING

SOT78 (TO220AB)

SOT404 (D

PIN

DESCRIPTION

1

gate

2

drain

1

3

source

tab

drain

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

V

DSS

Drain-source voltage

T

-

55

V

V

DGR

Drain-gate voltage

T

-55

V

V

GS

Continuous gate-source

-

± 15

V

voltage

V

GSM

Peak pulsed gate-source

T

-

± 20

V

voltage

I

D

Continuous drain current

T

-

75

2

A

T

-

75

2

A

I

DM

Pulsed drain current

T

-

240

A

P

D

Total power dissipation

T

-

230

W

T

Operating junction and

- 55

175

˚C

storage temperature

d

g

s

13

tab

2

12 3

tab

1 It is not possible to make connection to pin:2 of the SOT404 package

2 maximum current limited by package