2.4GHz SiGe Linear Power Amplifier

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3

Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not recommended.

and characterization.

Note 3: Idle current is controlled by external DAC for best efficiency over the entire output power range.

Note 4: Parameter is measured with RF modulation based on IEEE 802.11b standard.

Note 5: Minimum and maximum specifications are guaranteed by design and characterization.

Note 6: Operation outside this range is possible but not guaranteed.

Note 7: The total turn-on time required for PA output power to settle to within 0.5dB of the final value.

Note 8: Specification is corrected for PC board loss of approximately 0.3dB, on the output of the MAX2247 EV kit.

Note 9: Total turn-off time required for PA supply current to fall below 10µA.

Note 10: See the Typical Operating Characteristics for statistical variation.

AC ELECTRICAL CHARACTERISTICS

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

RF Frequency Range

(Notes 4, 6)

2.4 to 2.5

GHz

26

29.5

25

29.5

Power Gain (Notes 2, 4, 8)

30.5

dB

Gain Variation Over Supply

Voltage (Note 4)

±0.5

dB

22

23

24

Output Power Over Temperature

(Notes 4, 8)

ACPR: First-side lobe < -32dBc,

second-side lobe < -55dBc

25

dBm

Saturated Output Power

27.8

dBm

Harmonic Output (2f, 3f, 4f)

-45

dBc

Input VSWR

1.8:1

2.5:1

Output VSWR

2:1

2.5:1

Power Ramp Turn-On Time

(Note 7)

0.8

1.5

µs

Power Ramp Turn-Off Time

(Note 9)

0.8

1.5

µs

RF Output Detector

Response Time

0.9

µs

1

0.6

RF Output Detector Voltage

(Note 10)

0.47

V