Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating

the device beyond its rated operating conditions.

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.

Parasitic components and or ESD protection circuitry are shown in the figure below for the LM82’s pins. The nominal breakdown voltage of the zener D3 is 6.5 V.

Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−, ADD1 and ADD0. Doing so by more than 50 mV may corrupt a temperature

or voltage measurement.

Pin Name

D1

D2

D3

D4

Pin Name

D1

D2

D3

D4

NC (pins1&5)

T_CRIT_A & INT

x

V

CC

x

SMBData

x

x

D+

x

x

x

NC (pins9&15)

x

x

x

D−

xxxx

SMBCLK

x

x

ADD0, ADD1

x

x

x

NC (pin 13)

x

x

Note: An x indicates that the diode exists.

Note 3: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National Semicon-

ductor Linear Data Book for other methods of soldering surface mount devices.

Note 4: Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin.

Note 5: Thermal resistance of the QSOP-16 package is 130˚C/W, junction-to-ambient when attached to a FR-4 printed circuit board with 1 oz. foil as shown in

Fig-

SMBus TIMEOUT

DS101297-7

See drawing DS10129707

DS101297-13

FIGURE 1. ESD Protection Input Structure

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