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F2933 Datasheet(PDF) 2 Page - Integrated Device Technology

Part # F2933
Description  High Reliability SP2T RF Switch
PDF  19 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

F2933 Datasheet(HTML) 2 Page - Integrated Device Technology

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F2933
High Reliability SP2T RF Switch
2
F2933, Rev O 05/04/2016
ABSOLUTE MAXIMUM RATINGS
Parameter / Condition
Symbol
Min
Max
Unit
VDD to GND
VDD
-0.3
+6.0
V
VCTL to GND
Vlogic
-0.3
Lower of
3.6, VDD+0.3
V
RF1, RF2, RFC to GND
VRF
-0.3
+0.3
V
RF Input Power
1
RF1 or RF2 as an input
(Connected to RFC)
PRF12
36
dBm
RFC as an input
(Connected to RF1 or RF2)
PRFC
36
RF1 or RF2 as input
(Terminated states)
PRF12_TERM
30
Maximum Junction Temperature
TJmax
+140
°C
Storage Temperature Range
TST
-65
+150
°C
Lead Temperature (soldering, 10s)
TLEAD
+260
°C
ESD Voltage– HBM (Per JESD22-A114)
VESDHBM
Class 2 (2000V)
ESD Voltage – CDM (Per JESD22-C101)
VESDCDM
Class C3 (1000V)
Note 1: VDD = 2.7 V to 5.5 V, 50 MHz ≤ FRF ≤ 8000 MHz, Tc= 105 ºC, ZS = ZL = 50 ohms.
Note 2: Each port.
Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at
these or any other conditions above those indicated in the operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL AND MOISTURE CHARACTERISTICS
θJA (Junction – Ambient)
60 °C/W
θJC (Junction – Case) The Case is defined as the exposed paddle
3.9 °C/W
Moisture Sensitivity Rating (Per J-STD-020)
MSL1



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