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FPH Datasheet(PDF) 1 Page - Laird Tech Smart Technology

Part # FPH
Description  Foam-in-place
PDF  2 Pages
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Manufacturer  LSTD [Laird Tech Smart Technology]
Direct Link  http://www.lairdtech.com/
Logo LSTD - Laird Tech Smart Technology

FPH Datasheet(HTML) 1 Page - Laird Tech Smart Technology

  FPH Datasheet HTML 1Page - Laird Tech Smart Technology FPH Datasheet HTML 2Page - Laird Tech Smart Technology  
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Eccostock®FPH
High Temperature Foam-in-Place Liquid
HIGH TEMPERATURE FOAM-IN-PLACE LIQUID
Eccostock FPH is a two part closed cell foam-in-place resin system. It is a rigid, high temperature
polyurethane (isocyanate). Once cured, Eccostock FPH will withstand continuous exposure up to 135°C
(275°F) and up to 163°C (325°F) for short periods remaining rigid.
FEATURES AND BENEFITS
Maintains rigid characteristics at high service
temperatures
Foam-in-place
MARKETS
Commercial Telecom
Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
ECCOSTOCK FPH
Bulk Density lbs/ft
3 (g/cc)
2 (0.03)
8 (0.13)
14 (0.22)
Dielectric Constant (1 MHz)
1.04
1.12
1.25
Dissipation Factor (1 MHz)
0.001
0.002
0.005
Dielectric Strength, volts/mil
40
40
40
Compressive Strength, psi (kg/cm²)
30 (2.1)
250 (17.6)
600 (42.3)
Flexural Strength at 5% strain, psi (kg/cm²)
25 (1.8)
225 (15.8)
800 (56.0)
Flexural Modulus, psi (kg/cm2)
500 (35.2)
7,000 (493)
20,000 (1408)
Tensile Strength, psi (kg/cm2)
40 (2.8)
200 (14.1)
450 (31.7)
Shear Strength, psi (kg/cm²)
35 (2.5)
140 (9.9)
300 (21.1)
Coefficient of Thermal Expansion per °C
25 x 10
-6
40 x 10
-6
50 x 10
-6
Water Absorption, % of gain in 24 hours
3
1.5
1
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
APPLICATIONS
As Eccostock FPH maintains its rigid characteristics at high service temperatures, it is suitable for
structural applications.
Its foam-in-place characteristic makes it an excellent choice for encapsulation applications.
Encapsulation of electronic modules, antennas, rockets, satellites and missiles.
Encapsulation of coiled waveguide delay line to provide rigidity
Vibration and sound deadener when applied to interior surfaces of an instrument cabin.
Encapsulation of crystal ovens for temperature stability.
Staking material for high Q coils.
AVAILABILITY
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Size I
Size II
Size III
FPH Resin
1.3 Lbs.
5.2 Lbs.
45.4 Lbs.
Catalyst (12-2H)
0.9 Lbs.
3.4 Lbs.
29.5 Lbs.
Catalyst (12-4H)
1.0 Lbs.
3.9 Lbs.
34.1 Lbs.
Catalyst (12-6H)
1.0 Lbs.
3.9 Lbs.
34.1 Lbs.
Catalyst (12-10H)
1.1 Lbs.
4.4 Lbs.
38.6 Lbs.
Kit Availability


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