BTM410/411

Embedded Wireless Solutions

Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

21

Laird Technologies

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Figure 6-1: BTM410 and BTM411 Shipping Tray Details

6.3 Reflow Parameters

Laird’s surface mount modules are designed to be easily manufactured, including reflow

soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate

solder paste and to ensure oven temperatures during reflow meet the requirements of the solder

paste. Laird Technologies’ surface mount modules conform to J-STD-020D1 standards for reflow

temperatures.

IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30

seconds.

Figure 6-2: Recommended Reflow Temperature

Temperatures should not exceed the minimums or maximums presented in Table 6-1.

Table 6-1: Recommended Maximum and minimum temperatures

Specification

Value Unit

Temperature Inc./Dec. Rate

(max)

3

°C /

Sec

Temperature Decrease rate

(goal)

2-3

°C /

Sec

Soak Temp Increase rate (goal)

.5 - 1

°C /

Sec

Flux Soak Period (Min)

60

Sec

Flux Soak Period (Max)

90

Sec

Flux Soak Temp (Min)

150

°C

Flux Soak Temp (max)

190

°C

Time Above Liquidous (max)

60

Sec

Time Above Liquidous (min)

20

Sec