TM

Innovative Technology

for a Connected World

Ceramic Plate Series CP14,51,06

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FEATURES

• PreciseTemperatureControl

• CompactGeometricSizes

• ReliableSolidStateOperation

• NoSoundorVibration

• EnvironmentallyFriendly

• DCOperation

• RoHSCompliant

APPLICATIONS

• MedicalLasers

• LabScienceInstrumentation

• ClinicalDiagnosticSystems

• PhotonicsLaserSystems

• ElectronicEnclosureCooling

• Food&BeverageCooling

• Chillers(LiquidCooling)

TheCeramicPlate(CP)SeriesofThermoelectricModules(TEMs)isconsidered

‘thestandard’inthethermoelectricindustry.

Thisbroadproductlineofhigh-performanceandhighlyreliableTEMsisavailable

innumerousheatpumpingcapacities,geometricshapes,andinputpowerranges.

AssembledwithBismuthTelluridesemiconductormaterialandthermallyconductive

AluminumOxideceramics,theCPSeriesisdesignedforhighercurrentandlarge

heat-pumpingapplications.

PERFORMANCE SPECIFICATIONS

Hot Side Temperature (°C)

25

50

Qmax (Watts)

20.6

22.6

Delta Tmax (°C)

67

75

Imax (Amps)

6.0

6.0

Vmax (Volts)

5.8

6.6

Module Resistance (Ohms)

0.90

1.02

SUFFIX THICKNESS

(PRIOR TO TINNING)

FLATNESS &

PARALLELISM

HOT

FACE

COLD

FACE

Lead

Length

L1

0.150” ± 0.001”

0.001” / 0.001”

Lapped

Lapped

4.5”

L2

0.150” ± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

4.5”

SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION

RT

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

EP

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

SEALING OPTION