| Electronic Components Datasheet Search |
|
LMH6572 Datasheet(PDF) 10 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
LMH6572 Datasheet(HTML) 10 Page - National Semiconductor (TI) |
|
10 / 12 page ![]() Application Notes (Continued) R 2 should be kept small compared to R1 in order to not reduce the ENABLE voltage and to produce little or no delay to ENABLE. Other Applications The LMH6572 may be utilized in systems that involve a single RGB channel as well whenever there is a need to switch between different “flavors” of a single RGB input. Here are some examples: 1. RGB positive polarity, negative polarity switch 2. RGB full resolution, High Pass filter switch In each of these applications, the same RGB input occupies one set of inputs to the LMH6572 and the other “flavor” would be tied to the other input set. DRIVING CAPACITIVE LOADS Capacitive output loading applications will benefit from the use of a series output resistor R OUT. Figure 6 shows the use of a series output resistor, R OUT, to stabilize the amplifier output under capacitive loading. Capacitive loads of 5 to 120 pF are the most critical, causing ringing, frequency response peaking and possible oscillation. The chart “Sug- gested R OUT vs. Cap Load” gives a recommended value for selecting a series output resistor for mitigating capacitive loads. The values suggested in the charts are selected for .5 dB or less of peaking in the frequency response. This gives a good compromise between settling time and bandwidth. For applications where maximum frequency response is needed and some peaking is tolerable, the value of R OUT can be reduced slightly from the recommended values. LAYOUT CONSIDERATIONS Whenever questions about layout arise, use the evaluation board as a guide. The LMH730151 is the evaluation board supplied with samples of the LMH6572. To reduce parasitic capacitances, ground and power planes should be removed near the input and output pins. For long signal paths con- trolled impedance lines should be used, along with imped- ance matching elements at both ends. Bypass capacitors should be placed as close to the device as possible. Bypass capacitors from each rail to ground are applied in pairs. The larger electrolytic bypass capacitors can be located farther from the device, the smaller ceramic capacitors should be placed as close to the device as possible. In Figure 1 and Figure 2, the capacitor between V + and V− is optional, but is recommended for best second harmonic distortion. Another way to enhance performance is to use pairs of .01 µF and .1 µF ceramic capacitors for each supply bypass. 20109619 FIGURE 5. Delay Circuit Implementation 20109624 FIGURE 6. Decoupling Capacitive Loads 20109604 FIGURE 7. Recommended R OUT vs. Capacitive Load 20109613 FIGURE 8. Frequency Response vs. Capacitive Load www.national.com 10 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |