Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SUFFIX

THICKNESS

(PRIOR TO TINNING)

FLATNESS &

PARALLELISM

HOT

FACE

COLD

FACE

LEAD

LENGTH

11

0.065” +/- 0.002”

0.002” / 0.002”

Lapped

Lapped

2.0”

TB

0.065” +/- 0.0005”

0.0005” / 0.0005”

Lapped

Lapped

2.0”

00

0.064” +/- 0.005”

NA / NA

Metallized

Metallized

2.0”

22

0.064” +/- 0.005”

NA / NA

Pre-tinned

Pre-tinned

2.0”

GG

0.064” +/- 0.005”

NA / NA

Au Plated

Au Plated

2.0”

FEATURES

• Miniaturegeometricsizes

• Precisetemperaturecontrol

• Reliablesolidstateoperation

• Nosoundorvibration

• DCoperation

• RoHScompliant

APPLICATIONS

• Laser diodes

• CCD cameras

• Infrared(IR)sensors

• Pump lasers

• Crystal oscillators

• Opticaltransceivers

usedinapplicationstostabilizethetemperatureofsensitiveopticalcomponentsintelecomand

photonicsindustries.

Thisproductlineisavailableinmultipleconfigurationsandsurfacefinishingoptions.AssembledwithBismuth

Seriesisdesignedforlowercurrentandlowerheat-pumpingapplications.Customdesignsareavailable

toaccommodatemetallization,pretinning,ceramicpatterns,andsolderposts,howeverMOQapplies.

PERFORMANCE SPECIFICATIONS

Hotsidetemperature(°C)

25

50

Qmax(watts)

3.0

3.3

DeltaTmax(°C)

65

75

Imax(amps)

1.9

1.9

Vmax(volts)

2.7

3.0

Moduleresistance(ohms)

1.26

1.42

SUFFIX

SEALANT

COLOR

TEMP RANGE

DESCRIPTION

RT

RTV

White

-60to204°C

Non-corrosive,siliconeadhesivesealant

EP

Epoxy

Black

-55to150°C

Lowdensitysyntacticfoamepoxyencapsulant

SEALING OPTION