TM

Innovative Technology

for a Connected World

Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SuffIx ThIckneSS

(prIor To TInnIng)

flaTneSS &

parallelISm

hoT face cold face lead lengTh

11

0.077” +/- 0.002”

0.002” / 0.002”

lapped

lapped

2.0”

TB

0.077” +/- 0.0005”

0.0005” / 0.0005” lapped

lapped

2.0”

00

0.087” +/- 0.005”

na / na

metallized

metallized

2.0”

22

0.087” +/- 0.005”

na / na

pre-tinned

pre-tinned

2.0”

gg

0.087” +/- 0.005”

na / na

au plated

au plated

2.0”

FEATurES

• Miniaturegeometricsizes

• Precisetemperaturecontrol

• Reliablesolidstateoperation

• Nosoundorvibration

• DCoperation

• RoHScompliant

AppliCATiOnS

•Laserdiodes

•CCDcameras

•Infrared(IR)sensors

•Pumplasers

•Crystaloscillators

•Opticaltransceivers

usedinapplicationstostabilizethetemperatureofsensitiveopticalcomponentsintelecomand

photonicsindustries.

Thisproductlineisavailableinmultipleconfigurationsandsurfacefinishingoptions.Assembledwith

BismuthTelluridesemiconductormaterialandthermallyconductiveAluminumOxideceramics,

designsareavailabletoaccommodatemetallization,pretinning,ceramicpatterns,andsolderposts,

howeverMOQapplies.

performance SpecIfIcaTIonS

Hotsidetemperature(°C)

25

50

Qmax(watts)

3.0

3.4

DeltaTmax(°C)

67

77

Imax(amps)

1.5

1.5

Vmax(volts)

3.4

3.9

Moduleresistance(ohms)

2.09

2.35

SuffIx SealanT

color

Temp range deScrIpTIon

rT

rTV

White

-60to204°C

Non-corrosive,siliconeadhesivesealant

ep

Epoxy

Black

-55to150°C

Lowdensitysyntacticfoamepoxyencapsulant

SEAling OpTiOn