TM

SUFFIX THICKNESS

(PRIOR TO TINNING)

FLATNESS &

PARALLELISM

HOT

FACE

COLD

FACE

Lead

Length

TA

0.163” +/- 0.001”

0.001” / 0.001”

Lapped

Lapped

6.0”

TB

0.163” +/- 0.0005”

0.0005” / 0.0005” Lapped

Lapped

6.0”

SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION

R

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

E

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

Innovative Technology

for a Connected World

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FEATURES

• StrongLeadAttachment

• PreciseTemperatureControl

• ReliableSolidStateOperation

• NoSoundorVibration

• DCOperation

• RoHSCompliant

APPLICATIONS

• AnalyticalInstrumentation

• PhotonicsLaserSystems

• ElectronicEnclosureCooling

• FoodandBeverageCooling

• Chillers(LiquidCooling)

• ConsumerAppliances

sideoftheceramichasanextendededgethatallowsstrongleadattachment

toaccommodatethewiringofmultipleTEMsintoanarray.

Thisproductlineisavailablein4,6,and8Ampconfigurationsandisidealforhigh-

volumeproduction.AssembledwithBismuthTelluridesemiconductormaterial

designedforhighercurrentandlargerheat-pumpingapplications.

PERFORMANCE SPECIFICATIONS

Hot Side Temperature (°C)

25°C

50°C

Qmax (Watts)

18.4

20.2

Delta Tmax (°C)

67

75

Imax (Amps)

3.8

3.8

Vmax (Volts)

8.1

9.2

Module Resistance (Ohms)

1.95

2.20

SEALING OPTION