TM

Innovative Technology

for a Connected World

Thermally Conductive PCB Substrate

TherMAlly ConduCTive PrinTed CirCuiT BoArd SuBSTrATe

copper circuit layer bonded to an aluminum or copper base plate with Laird Technologies’ 3 watt/m-K 1KA

Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping

components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire

bond processes.

Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to

thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with

ceramic devices.

Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch

thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper

base plates are also available.

FeATureS And BeneFiTS

• UL 746B Electrical/Mechanical RTI as

high as 130°C

• RoHS compliant

• Environmentally green

• Lead-free solder compatible

• Compliant for low bond stress

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

APPliCATionS

• Network DC/DC power converters

• Battery powered equipment DC/DC

power converters

• Ultra bright LED substrates