TM

Innovative Technology

for a Connected World

Tpcm™ 900 is a high performance, non-electrically conductive phasechange material.

At 50°C, Tpcm™ 900 begins to soften and flow,filling the microscopic irregularities

of both the thermal solution andthe component’s surfaces, thereby reducing thermal

resistance.It is a flexible solid at room temperature and freestandingwithout reinforcing

components that reduce thermal performance.

Tpcm 900 shows no performance degradation after 1,000hours @130°C, or after 500

cycles, from -25°C to 125°C. The material softens and does not fully change state, result-

ing in minimal migration(pump out) at operating temperatures (see viscosity curve).

Supplied in rolls with top tabbed liners for easy manual orlarge volume automatic

application. Individually die cut parts can alsobe supplied.

FEATURES AND BENEFITS

• 0.03ºC-in2/watt thermal resistance

• Naturally tacky at room temperature,

no adhesive required

• No heatsink preheating required

• Available in 3 thicknesses, 0.005”, 0.010”and

0.020” (0.125 mm, 0.25 mm and 0.50 mm)

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

PROPERTIES

Tpcm™ 905C

Tpcm™ 910

Tpcm™ 920

Test Method

Construction &

Composition

Non-reinforced

boron nitride filled film

Non-reinforced

boron nitride filled film

Non-reinforced

boron nitride filled film

Color

Yellow

Yellow

Yellow

Visual

Thickness

0.005” (0.13 mm)

0.010” (0.25 mm)

0.020” (0.51 mm)

Thickness Tolerance

± 0.001” (± 0.025 mm)

± 0.001” (± 0.025 mm)

± 0.002” (± 0.05 mm)

Density

1.31 g/cc

1.39 g/cc

1.39 g/cc

Helium Pycnometer

Temperature Range

-25 to 125°C

-25 to 125°C

-25 to 125°C

Phase Change

Softening Temperature

50°C to 70°C

50°C to 70°C

50°C to 70°C

“Burn In“ Temperature

70°C for 5 minutes

70°C for 5 minutes

70°C for 5 minutes

Thermal Conductivity

0.7 W/mK

2.23 W/mK

2.23 W/mK

ASTM D5470

(modified)

Thermal Impedance

@ 10 psi (69 KPa)

@ 50 psi (345 KPa))

ASTM D5470

(modified

Volume Resistivity

ASTM D257

Dielectric Constant

@1 MHz

3.1

3.1

3.1

ASTM D150

THR-DS-Tpcm-900 0910

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and

application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the

fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages

of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request.

© Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technolo-

gies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party

intellectual property rights.

APPLICATIONS

• High frequency

microprocessors

• Notebook and

desktop PCs

• Computer servers

• DC/DC converts

• Memory modules

• Cache chips

• IGBTs

Standard Thicknesses: 0.005” (0.13 mm) 0.010” (0.25 mm) 0.020” (0.51 mm)

Consult the factory for alternate thicknesses

Standard Sheet Sizes: 9” x 9” (229 mm x 229 mm)

Tpcm™ 900 sheets are supplied with a white release paper and a bottom liner.

Tpcm™ 900 is available in rolls with an extended tab liner or individual die cut shapes.

Pressure Sensitive Adhesive: Pressure sensitive adhesive is not applicable for Tpcm™ products.

Reinforcement: No reinforcement is necessary.