TM

Innovative Technology

for a Connected World

Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SUFFIX

THICKNESS

FLATNESS &

PARALLELISM

HOT

FACE

COLD

FACE

LEAD

LENGTH

TA

0.110” +/- 0.001”

0.0008” / 0.0016”

Lapped

Lapped

6.0”

2.80 +/- 0.02 mm

0.02 mm / 0.04 mm

Lapped

Lapped

152.4 mm

FEATURES

• Highheatpumpdensity

• Precisetemperaturecontrol

• Reliablesolidstateoperation

• Nosoundorvibration

• DCoperation

• RoHScompliant

APPLICATIONS

• Analyticalinstrumentation

• Clinicaldiagnostics

• Photonicslasersystems

• Electronicenclosurecooling

• Foodandbeveragecooling

• Chillers(liquidcooling)

assembledwithalargenumberofsemiconductorcouplestoachieveahigherheatpumpingcapacity

thanstandardsinglestageTEMs.

Thisproductlineisavailableinmultipleconfigurationsandisidealforapplicationsthatrequirehigher

coolingcapacitieswithlimitedsurfacearea.AssembledwithBismuthTelluridesemiconductormaterial

currentandlargerheat-pumpingapplications.

PERFORMANCE SPECIFICATIONS

Hotsidetemperature(°C)

25

Qmax(watts)

206

DeltaTmax(°C)

68

Imax(amps)

9.2

Vmax(volts)

36.7

SUFFIX SEALANT

COLOR

TEMP RANGE DESCRIPTION

RT

RTV

White

-60to204°C

Non-corrosive,siliconeadhesivesealant

EP

Epoxy

Black

-55to150°C

Lowdensitysyntacticfoamepoxyencapsulant

SEALING OPTION