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LMH6714MFX Datasheet(PDF) 12 Page - National Semiconductor (TI) |
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LMH6714MFX Datasheet(HTML) 12 Page - National Semiconductor (TI) |
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12 / 15 page ![]() Application Section (Continued) POWER DISSIPATION Follow these steps to determine the Maximum power dissi- pation for the LMH6714/6720/6722: 1. Calculate the quiescent (no load) power: P AMP =ICC (V CC -VEE) 2. Calculate the RMS power at the output stage: P OUT (RMS) = ((V CC -VOUT (RMS)) * IOUT (RMS)), where V OUT and IOUT are the voltage and current across the external load. 3. Calculate the total RMS power: P T =PAMP +POUT The maximum power that the LMH6714/6720/6722, pack- age can dissipate at a given temperature can be derived with the following equation: P MAX = (150˚ - TA)/ θ JA, where TA = Ambient temperature (˚C) and θ JA = Thermal resistance, from junction to ambient, for a given package (˚C/W). For the SOIC package θ JA is 148˚C/W, for the SOT it is 250˚C/W. 20056522 FIGURE 8. 20056529 FIGURE 9. Digital Signal without and with Equalization 20056530 FIGURE 10. Design Equations 20056517 FIGURE 11. Equalizer Frequency Response www.national.com 12 |
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