ESDALC6V1P6

8/10

®

PACKAGE MECHANICAL DATA

SOT-666IP (internal Pad)

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A

0.53

0.60

0.021

0.024

A3

0.13

0.18

0.005

0.007

D

1.50

1.70

0.059

0.067

D2

1.05

1.25

0.041

0.049

E

1.50

1.70

0.059

0.067

E1

1.10

1.30

0.043

0.051

E2

0.23

0.43

0.009

0.017

L1

0.11

0.26

0.004

0.010

L2

0.10

0.30

0.004

0.012

L3

0.05

-

0.002

-

L4

0.83 Ref

0.032

b

0.14

0.25

0.006

0.010

b1

-

0.34

0.013

e

0.50 Bsc

0.020

e1

0.20

-

0.008

Θ

8°

12°

8°

12°

FOOT PRINT DIMENSIONS (in millimeters)

A3

A

Θ(4x)

b1

L1

L3

b

e1

e

L4

L2

D

E

E1

0.30

0.50

2.60

0.62

0.99

0.21

1.40

0.20