SN74LVC1G240

SINGLE BUFFER/DRIVER

WITH 3STATE OUTPUT

SCES305H − JANUARY 2001 − REVISED OCTOBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable

(OE) input is high.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC1G240YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC1G240YZAR

_ _ _CK_

−40 C to 85 C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G240YEPR

_ _ _CK_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC1G240YZPR

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G240DBVR

C40_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G240DBVT

C40_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G240DCKR

CK_

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G240DCKT

CK_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

OE

A

GND

Y

3

2

1

4

5

GND

A

OE

Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.