OPA695

2

SBOS293B

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA695

SO-8

D

–40

°C to +85°C

OPA695

OPA695ID

Rails, 100

""

"

"

"

OPA695IDR

Tape and Reel, 2500

OPA695

DBV

–40

°C to +85°C

A71L

OPA695IDBVT

Tape and Reel, 250

""

"

"

"

OPA695IDBVR

Tape and Reel, 3000

Power Supply ...............................................................................

±6.5V

DC

Internal Power Dissipation ..................................... See Thermal Analysis

Differential Input Voltage ..................................................................

±1.2V

Input Common-Mode Voltage Range .................................................

±V

S

Storage Temperature Range: D, DBV ........................... –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

ESD Rating

Charge Device Model (CDM) .......................................................... 1000V

Machine Model (MM) ......................................................................... 100V

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) Pin 2 on SO-8 package and pin 4 on SOT23-6 package > 500V

HBM.

PIN CONFIGURATIONS

Top View

SO

NC = No Connection

Top View

SOT23-6

1

2

3

4

8

7

6

5

NC

Inverting Input

Noninverting Input

–V

S

DIS

+V

S

Output

NC

1

2

3

6

5

4

Output

–V

S

Noninverting Input

+V

S

DIS

Inverting Input

12

3

65

4

Pin Orientation/Package Marking

A71L

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

(2) The SOT23-6 is shipped only as a lead-free and

green package. Check TI web site for lead-free availability of other packages.