2003 Oct 03

3

Philips Semiconductors

Product specification

PNP/PNP resistor-equipped transistors;

R1 = 10 k

Ω, R2 = 47 kΩ

PEMB9; PUMB9

ORDERING INFORMATION

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.

2. Reflow soldering is the only recommended soldering method.

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

PEMB9

−

plastic surface mounted package; 6 leads

SOT666

PUMB9

−

plastic surface mounted package; 6 leads

SOT363

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Per transistor

collector-base voltage

open emitter

−−50

V

collector-emitter voltage

open base

−−50

V

emitter-base voltage

open collector

−−10

V

input voltage

positive

−

+6

V

negative

−−40

V

output current (DC)

−−100

mA

peak collector current

−−100

mA

total power dissipation

SOT363

note 1

−

200

mW

SOT666

notes 1 and 2

−

200

mW

storage temperature

−65

+150

°C

junction temperature

−

150

°C

operating ambient temperature

−65

+150

°C

Per device

total power dissipation

SOT363

note 1

−

300

mW

SOT666

notes 1 and 2

−

300

mW