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Vishay Dale Thin Film

Revision: 15-Jun-16

2

Document Number: 60130

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ENVIRONMENTAL TESTS

ENVIRONMENTAL TEST

LIMITS MIL-PRF-55342

CHARACTERISTIC “H”

TYPICAL VISHAY

PERFORMANCE

Resistance temperature characteristic

± 50 ppm/°C

± 25 ppm/°C

Maximum ambient temperature at rated wattage

+70 °C

+70 °C

Maximum ambient temperature at power derating

+150 °C

+150 °C

Thermal shock

± 0.25 %

± 0.10 %

Low temperature operation

± 0.25 %

± 0.10 %

Short time overload

± 0.1 %

± 0.10 %

High temperature exposure

± 0.2 %

± 0.10 %

Resistance to soldering heat

± 0.25 %

± 0.10 %

Moisture resistance

± 0.4 %

± 0.50 %

Life at +70 °C for 1000 h

± 0.5 %

± 1.00 %

DIMENSIONS in inches

CASE SIZE

LENGTH

L

WIDTH

W

THICKNESS

T

MIN./MAX.

TOP PAD

D

BOTTOM PAD

E

1206

0.126 ± 0.008

0.063 ± 0.005

0.015 ± 0.003

0.020 + 0.005 / - 0.010

0.040 ± 0.005

2512

0.259 + 0.009 / - 0.015

0.124 ± 0.005

0.015 ± 0.003

0.020 ± 0.005

0.050 ± 0.005

LAND PATTERN DIMENSIONS in inches

STANDARD MATERIAL SPECIFICATIONS

Resistive element

Nichrome

Substrate material

Aluminum nitride

Terminations (tin / lead)

Tin / lead solder over nickel barrier

Terminations (lead (Pb)-free)

Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over nickel barrier

D

L

E

T

W

L

DT

0.2910

0.1260

0.0910

0.1090

2512 Land Pattern

0.1730

0.0710

0.0755

0.0220

1206 Land Pattern