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RCP Datasheet(PDF) 1 Page - Vishay Siliconix |
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RCP Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 4 page ![]() RCP www.vishay.com Vishay Dale Revision: 13-Dec-16 1 Document Number: 31098 For technical questions, contact: ff2aresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate Aluminum nitride over 3 x more power - same size FEATURES • Thick film resistive element on an aluminum nitride (AlN) substrates • Very high thermal conductivity in a small package size • Termination: tin/lead wraparound termination over nickel barrier. Also available with lead (Pb)-free wraparound terminations. • Capability to develop specific reliability programs designed to customer requirements • Operating temperature range: -55 °C to +155 °C • High frequency performance to 6 GHz • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details. Notes • Consult factory for availability of additional case sizes. (1) The power rating depends on the maximum temperature of the resistive element. The temperature of the resistive element and adjacent materials will rise due to the power dissipation of the resistor. The majority of this heat/energy is dissipated by conduction through the substrate, terminations, solder joints, and printed circuit board. The maximum power rating in a particular application only applies if the temperature of the resistive element is maintained at or below 155 °C. Note • For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543). MATERIAL SPECIFICATIONS Resistive element Ruthenium oxide Encapsulation Epoxy Substrate Aluminum nitride Termination Solder-coated nickel barrier Solder finish Pure tin or tin/lead solder alloy Available Available STANDARD ELECTRICAL SPECIFICATIONS GLOBAL MODEL CASE SIZE POWER RATING (1) (Standard Board Mount) P25 °C W POWER RATING (1) (Active Temperature Control) W MAXIMUM WORKING VOLTAGE V RESISTANCE RANGE TOLERANCE ± % TEMPERATURE COEFFICIENT ± ppm/°C RCP0505 0505 1.4 5.0 10 to 2K 1, 2, 5 150 RCP0603 0603 1.5 3.9 10 to 2K 1, 2, 5 150 RCP1206 1206 2.4 11 10 to 2K 1, 2, 5 150 RCP2512 2512 3.5 22 10 to 2K 1, 2, 5 150 GLOBAL PART NUMBER INFORMATION New Global Part Numbering: RCP1206W100RGWB (preferred part numbering format) GLOBAL MODEL BOTTOM TERM. RESISTANCE VALUE TOLERANCE CODE PACKAGING CODE SPECIAL RCP0505 RCP0603 RCP1206 RCP2512 W = wide B = traditional R = K = k 10R0 = 10 1K30 = 1.3 k F = ± 1 % G = ± 2 % J = ± 5 % TP = tin / lead, T/R (full reel) S3 = tin / lead, T/R (1000 pieces) WB = tin / lead, tray S2 = tin / lead, T/R (500 pieces) S6 = tin / lead, T/R (300 pieces) blank = standard (dash number) (up to 3 digits) from 1 to 999 as applicable EA = lead (Pb)-free, T/R (full reel) EB = lead (Pb)-free, T/R (1000 pieces) ET = lead (Pb)-free, tray EC = lead (Pb)-free, T/R (500 pieces) ED = lead (Pb)-free, T/R (300 pieces) P x R P x R P x R P x R C P 1206 W 1 0 R 0R G W B |
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