G901 datasheet(2/5 Pages) ETC

2 / 5 page

Ver: 1.0

Mar 22, 2002

TEL: 886-3-5788833

http://www.gmt.com.tw

G901

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)

Input Voltage………………………………….……….10V

Power Dissipation Internally Limited

(Note2)

Maximum Junction Temperature………….………150°C

Storage Temperature Range..….…-65°C

≤ TJ ≤+150°C

Lead Temperature, Time for Wave Soldering

SOT89 Package……..……..……………….....260°C, 4s

Continuous Power Dissipation (TA = + 25°C)

SOT 89

(1)………………………….…………………..0.5W

Note (1): See Recommended Minimum Footprint.

Operating Conditions

(Note 1)

Input Voltage…………………………...…………4V ~ 7V

Temperature Range……………….…...0°C

≤ TJ ≤125°C

Electrical Characteristics

VIN =5V, IO = 300mA, CIN=1µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3]

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Output Voltage

5mA < IO <300mA

3.201

3.3

3.399

Line Regulation

4V < VIN < 6.5V, IO = 50mA

Load Regulation

10mA < IO < 300mA

Output Impedance

100mA DC and 100mA AC, fO = 120Hz

102

Ω

Quiescent Current

VIN = 5V

0.6

Ripple Rejection

fi = 120 Hz, 1VP-P, Io = 100mA

IO = 300mA

450

Dropout Voltage

IO = 50mA

100

Short Circuit Current

0.77

Over Temperature

150

°C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating

Conditions are conditions under which the device functions but the specifications might not be guaranteed. For

guaranteed specifications and test conditions see the Electrical Characteristics.

Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax; total thermal re-

sistance,

θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient

temperature is TJmax-TA/

θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and

IC will go into thermal shutdown. For the G901 in SOT89 package,

θJA is 250°C/W(See recommend

minimum footprint). The safe operation in SOT 89, it can see ”Typical Performance Characteristics” (Safe

Operating Area).

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos-

sible.

Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value, dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input

voltage. The measurement is made under conditions

of low dissipation or by using pulse techniques such

that average chip temperature is not significantly af-

fected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.

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