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September 2012

Doc ID 023081 Rev 2

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STEVAL-IFP016V2

IO-Link communication master transceiver demonstration board

based on the L6360, monolithic IO-Link master port

Data brief

Features

diagnostic

driver

and STEVAL-PCC009V1

surge, RF noise, etc., according to IEC61000-

4-2, IEC61000-4-4, IEC61000-4-5, and

IEC61000-4-6 standards

Description

The STEVAL-IFP016V2 IO-Link communication

master transceiver demonstration board is based

on the L6360, monolithic IO-Link master port. A

modular and customizable application that

interfaces externally with the microcontroller. The

purpose of the board is to demonstrate the

capability of the L6360 monolithic IO-Link master,

as communication transceiver for multiple I/Os.

The board uses input signal from the

microcontroller and outputs the 24 V required for

industrial applications.

The board demonstrates that the L6360 is both

IO-Link master port mode and standard IO mode

compliant.

The interface is compatible with the STEVAL-

PCC009V2 and STEVAL-PCC009V1 EMC-

immune application against ESD, burst, surge, RF

noise, etc., according to IEC61000-4-2,

IEC61000-4-4, IEC61000-4-5, and IEC61000-4-6

standards.

A large GND area on the printed circuit board has

been designed in order to minimize noise and

ensure good thermal performance.

The small size of the L6360 package with a

reduced pin number, along with the small size of

the application area, allow the user to work in

applications where space constraint is critical.

The L6360 is a monolithic IO-Link master port,

compliant with PHY2 (3 wires) supporting COM1

(4.8 kbaud), COM2 (38.4 kbaud) and COM3

(230.4 kbaud) modes. The output stage (high-

side, low-side or push-pull) as well as the cutoff

current, cutoff current delay time, and restart

The cutoff current and cutoff current delay time,

combined with the thermal shutdown and

automatic restart, protect the device against

overload and short-circuit. The output stages are

able to drive resistive, inductive and capacitive

loads. Fast demagnetization is able to dissipate

the energy stored in the inductive loads.

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