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STM32L476VC Datasheet(PDF) 219 Page - STMicroelectronics

Part # STM32L476VC
Description  Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 1MB Flash, 128 KB SRAM, USB OTG FS, LCD, analog, audio
PDF  232 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L476VC Datasheet(HTML) 219 Page - STMicroelectronics

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STM32L476xx
Package information
228
Figure 59. WLCSP81- 81-ball, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
F
-
0.6042
-
-
0.0238
-
G
-
0.2797
-
-
0.0110
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 109. WLCSP81 recommended PCB design rules (0.4 mm pitch)
Dimension
Recommended values
Pitch
0.4 mm
Dpad
0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
Table 108. WLCSP81- 81-ball, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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