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STM32L476VC Datasheet(PDF) 221 Page - STMicroelectronics |
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STM32L476VC Datasheet(HTML) 221 Page - STMicroelectronics |
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221 / 232 page ![]() DocID025976 Rev 4 221/232 STM32L476xx Package information 228 Figure 62. WLCSP72 - 72-ball, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 110. WLCSP72 - 72-ball, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.3734 4.4084 4.4434 0.1722 0.1736 0.1749 E 3.7244 3.7594 3.7944 0.1466 0.1480 0.1494 e - 0.400 - - 0.0157 - e1 - 3.200 - - 0.1260 - e2 - 3.200 - - 0.1260 - F - 0.6042 - - 0.0238 - G - 0.2797 - - 0.0110 - aaa - 0.100 - - 0.0039 - bbb - 0.100 - - 0.0039 - ccc - 0.100 - - 0.0039 - ddd - 0.050 - - 0.0020 - eee - 0.050 - - 0.0020 - |
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