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STFH10N60M2 Datasheet(PDF) 5 Page - STMicroelectronics |
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STFH10N60M2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() STFH10N60M2 Electrical characteristics DocID029418 Rev 3 5/12 Table 8: Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD(1) Source-drain current - 7.5 A ISDM(1)(2) Source-drain current (pulsed) - 30 A VSD(3) Forward on voltage ISD = 7.5 A, VGS = 0 V - 1.6 V trr Reverse recovery time ISD = 7.5 A, di/dt = 100 A/µs VDD = 60 V (see Figure 16: "Test circuit for inductive load switching and diode recovery times") - 270 ns Qrr Reverse recovery charge - 2 µC IRRM Reverse recovery current - 14.4 A trr Reverse recovery time ISD = 7.5 A, di/dt = 100 A/µs VDD = 60 V, Tj = 150 °C (see Figure 16: "Test circuit for inductive load switching and diode recovery times") - 376 ns Qrr Reverse recovery charge - 2.8 µC IRRM Reverse recovery current - 15 A Notes: (1)Limited by maximum junction temperature. (2)Pulse width limited by safe operating area. (3)Pulsed: pulse duration = 300 µs, duty cycle 1.5%. |
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