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STTS2004 Datasheet(PDF) 43 Page - STMicroelectronics |
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STTS2004 Datasheet(HTML) 43 Page - STMicroelectronics |
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43 / 58 page  DocID024229 Rev 3 43/58 STTS2004 Maximum ratings 58 7 Maximum ratings Stressing the device above the ratings listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 28. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature –65 to 150 °C TSLD(1) 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Lead solder temperature for 10 seconds 260 °C VIO Input or output voltage A0 VSS – 0.3 to 10.0 V others VSS – 0.3 to 4.3 V VDD Supply voltage VSS – 0.3 to 4.3 V IO Output current 10 mA PD Power dissipation 320 mW JA Thermal resistance 87.4 °C/W |
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