DS1486 datasheet(13/17 Pages) DALLAS

13 / 17 page

DS1486/DS1486P

13 of 17

NOTES:

1. WE is high for a read cycle.

2. OE = VIH or VIL. If OE = VIH during write cycle, the output buffers remain in a high impedance state.

3. tWP is specified as the logical AND of the CE and WE . tWP is measured from the latter of CE or WE

going low to the earlier of CE or WE going high.

4. tDS or tDH are measured from the earlier of CE or WE going high.

5. tDH is measured from WE going high. If CE is used to terminate the write cycle, then tDH = 20 ns for

-120 parts and tDH = -25 ns for -150 parts.

6. If the CE low transition occurs simultaneously with or later than the WE low transition in write cycle

1, the output buffers remain in a high impedance state during this period.

7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output

buffers remain in a high impedance state during this period.

8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,

the output buffers remain in a high impedance state during this period.

9. Each DS1486 is marked with a four-digit date code AABB. AA designates the year of manufacture.

BB designates the week of manufacture. The expected tDR is defined for DIP Modules as starting at

the date of manufacture.

10. All voltages are referenced to ground.

11. Applies to both interrupt pins when the alarms are set to pulse.

12. Interrupt output occurs within 100 ns on the alarm condition existing.

13. Both INTA and INTB (INTB) are open drain outputs.

14. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering

tech-niques as long as temperature exposure to the lithium energy source contained within does not

exceed +85

°C. Post-solder cleaning with water washing techniques is acceptable, provided that

ultrasonic vibration is not used.

In addition, for the PowerCap version:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live - bug”).

b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder

wick to remove solder.

DS1486 Datasheet(PDF) 13 Page - Dallas Semiconductor