DS1251/DS1251P

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DS1251P

PKG

INCHES

DIM

MIN

NOM

MAX

A

0.920

0.925

0.930

B

0.980

0.985

0.990

C

-

-

0.080

D

0.052

0.055

0.058

E

0.048

0.050

0.052

F

0.015

0.020

0.025

G

0.025

0.027

0.030

Note: Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live-bug”).

Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than three

seconds.

To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove the part, apply flux,

heat the lead frame pad until the solder reflows, and use a solder wick to remove solder.