6

ISO7730, ISO7731

SLLSES0D – SEPTEMBER 2016 – REVISED MAY 2017

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Product Folder Links: ISO7730 ISO7731

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ISO773x

UNIT

DW (SOIC)

DBQ (QSOP)

16 Pins

16 Pins

Junction-to-ambient thermal resistance

81.4

109

°C/W

Junction-to-case(top) thermal resistance

44.9

46.8

°C/W

Junction-to-board thermal resistance

45.9

60.6

°C/W

Junction-to-top characterization parameter

28.1

35.9

°C/W

Junction-to-board characterization parameter

45.5

60

°C/W

Junction-to-case(bottom) thermal resistance

—

—

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7730

Maximum power dissipation

input a 50-MHz 50% duty cycle square wave

150

mW

Maximum power dissipation by side-1

25

mW

Maximum power dissipation by side-2

125

mW

ISO7731

Maximum power dissipation

input a 50-MHz 50% duty cycle square wave

150

mW

Maximum power dissipation by side-1

50

mW

Maximum power dissipation by side-2

100

mW