P9221-R datasheet(9/35 Pages) IDT

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P9221-R Datasheet

April 4, 2017

4. Thermal Characteristics

Table 4.

Package Thermal Information

Note: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 76.2 x 114.3 mm in still air conditions.

Symbol

Description

WLCSP Rating 8 Thermal Balls

Units

θJA

Thermal Resistance Junction to Ambient[a]

C/W

θJC

Thermal Resistance Junction to Case

0.202

C/W

θJB

Thermal Resistance Junction to Board

4.36

C/W

Operating Junction Temperature[a]

-5 to +125

C

Ambient Operating Temperature[a]

0 to +85

C

TSTG

Storage Temperature

-55 to +150

C

TBUMP

Maximum Soldering Temperature (Reflow, Pb-Free)

260

C

[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will

result in excessive die temperature, and the device will enter thermal shutdown.

5. Electrical Characteristics

Table 5.

Electrical Characteristics

Note: VRECT = 5.5V; COUT = 4.7μF, EN

̅̅̅̅ = LOW, unless otherwise noted. TJ = 0C to 125C; typical values are at 25°C.

Symbol

Description

Conditions

Min

Typical

Max

Units

Under-Voltage Lock-Out (UVLO)

VUVLO_Rising

UVLO Rising

Rising voltage on VRECT

2.9

2.98

VUVLO_HYS

UVLO Hysteresis

VRECT falling

200

Over-Voltage Protection

VOVP-DC

DC Over-Voltage

Protection

Rising voltage

13.5

VOVP-HYS

Over-Voltage Hysteresis

Quiescent Current

IACTIVE_SUPLY

Supply Current

¯¯ = Low, No load; VRECT = 12.3V

3.0

ISHD

Shut Down Mode Current

¯¯ = High; VRECT = 12.3V

500

μA

VDD18 Voltage

VVDD18

VDD18 Pin Output

Voltage[a]

IVDD18 = 10mA, CVDD18 = 1µF

1.62

1.8

1.98

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