SSF859 datasheet(3/16 Pages) TI1

3 / 16 page

SN74SSTVF16859

13BIT TO 26BIT REGISTERED BUFFER

WITH SSTL_2 INPUTS AND OUTPUTS

SCES429B − MARCH 2003 − REVISED FEBRUARY 2004

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

logic diagram (positive logic)

To 12 Other Channels

RESET

Q1A

CLK

VREF

Q1B

One of 13 Channels

Pin numbers shown are for the DGG package.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC or VDDQ

−0.5 V to 3.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Notes 1 and 2)

−0.5 V to VCC + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, VO (see Notes 1 and 2)

−0.5 V to VDDQ + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0)

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VDDQ)

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, IO (VO = 0 to VDDQ)

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through each VCC, VDDQ, or GND

±100 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 3): DGG package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 4): RGQ package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This value is limited to 3.6 V maximum.

3. The package thermal impedance is calculated in accordance with JESD 51-7.

4. The package thermal impedance is calculated in accordance with JESD 51-5.

SSF859 Datasheet(PDF) 3 Page - Texas Instruments

SSF859 Datasheet(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Datasheet Download

Link URL