TSL13FN – 10

ams Datasheet: 2014-Jun-04 [1-00]

P a ck age Dra w ings & Mark ings

Figure 17:

Six-lead Surface Mount FN Package Configuration

Note(s) and/or Footnote(s):

1. All linear dimensions are in micrometers.

2. The Photodiode Active Area is centered within the package within a tolerance of ±75 micrometers.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is Copper Alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Package Drawings & Markings

500

500

2000±100

2000±100

PHOTODIODE

ACTIVE AREA

TOP VIEW

650±50

295 NOMINAL

END VIEW

6X 750±150

BOTTOM VIEW

CL OF PHOTODIODE ACTIVE AREA

CL OF SOLDER CONTACTS

SEE NOTE 2

CL OF PHOTODIODE ACTIVE AREA

CL OF SOLDER CONTACTS

SEE NOTE 2

6X 300±50

6X 97±20

4X 650

TSL13FN_Datasheet, Rev.: 1.0, TSL13FN_Datasheet_[1-00]_Light-To-Voltage Converters

Release Date: 2014-06-17, Key Contact: Matt Kroese