ST8034C datasheet(12/39 Pages) STMICROELECTRONICS

12 / 39 page

DocID024587 Rev 4

13/40

ST8034T, ST8034AT, ST8034P, ST8034C

Maximum ratings

Table 4. Absolute maximum ratings(1), (2)

1. Absolute maximum ratings are those values beyond which damage to the device may occur. Functional

operation under these conditions is not implied.

2. All card contacts are protected against short-circuit to any other card contact.

Symbol

Parameter

Min.

Max.

Unit

VDD

Supply voltage, logic

-0.3

VDDP

Supply voltage, power

-0.3

VDD(INTF)

Supply voltage, interface

-0.3

VIN

Input voltage on XTAL1, XTAL2, RSTIN, I/OUC,

CLKDIV, CS, VCC_SEL, CLKIN, PORADJ,

CMDVCC, OFF, PRES, and I/O pins

-0.3

VESD (HBM)

Human body model (HBM) on card lines - I/O, RST,

VCC, CLK, and PRES pins

-8

Human body model (HBM), all other pins

-2

VESD (MM)

Machine model (MM), all pins

-200

200

VESD (FCDM) Field charged device model (FCDM), all pins

-500

500

PTOT

Total power dissipation (TA = -25 to +85 °C)

0.25

TJ(MAX)

Maximum operating junction temperature

125

°C

TSTG

Storage temperature range

-55

150

°C

Table 5. Thermal data

Symbol

Parameter

Test

conditions

Typ.

Unit

RTHJA

Thermal resistance junction-ambient temperature

(multilayer test board - JEDEC standard)

SO16

°C/W

QFN16

°C/W

Table 6. Recommended operating conditions

Symbol

Parameter

Test conditions

Min.

Max.

Unit

Ambient temperature range

-25

°C

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