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ESDR0502B Datasheet(PDF) 2 Page - ON Semiconductor |
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ESDR0502B Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 4 page ![]() ESDR0502B, SZESDR0502B www.onsemi.com 2 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation C Capacitance @ VR = 0 and f = 1.0 MHz Uni−Directional TVS IPP IF V I IR IT VRWM VC VBR VF ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA for all types) Device* Device Marking VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) IT C (pF), uni−directional (Note 3) C (pF), bi−directional (Note 4) VC (V) @ IPP = 1 A (Note 5) VC Max Max Min mA Typ Max Typ Max Max Per IEC61000− 4−2 (Note 6) ESDR0502B AD 5.0 1.0 5.8 1.0 0.5 0.9 0.25 0.45 15 Figures 1 and 2 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Include SZ−prefix devices where applicable. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. Uni−directional capacitance at f = 1 MHz, VR = 0 V, TA = 25°C (pin1 to pin 3; pin 2 to pin 3). 4. Bi−directional capacitance at f = 1 MHz, VR = 0 V, TA = 25°C (pin1 to pin 2). 5. Surge current waveform per Figure 5. 6. Typical waveform. For test procedure see Figures 3 and 4 and Application Note AND8307/D. Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV contact per IEC 61000−4−2 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV contact per IEC 61000−4−2 |
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