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SW3406 Datasheet(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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SW3406 Datasheet(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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1 / 6 page ![]() Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. Jul. 2015. Rev. 1.0 1/6 SW3406 Absolute maximum ratings Symbol Parameter Value Unit V DSS Drain to source voltage 30 V I D Continuous drain current (@T C=25 oC) 4* A Continuous drain current (@T C=100 oC) 2.5* A I DM Drain current pulsed (note 1) 16 A V GS Gate to source voltage ± 20 V E AS Single pulsed avalanche energy (note 2) 26 mJ dv/dt Peak diode recovery dv/dt (note 3) 5 V/ns P D Total power dissipation (@T C=25 oC) 0.83 W Derating factor above 25oC 0.007 W/oC T STG, TJ Operating junction temperature & storage temperature -55 ~ + 150 oC Thermal characteristics Symbol Parameter Value Unit R thja Thermal resistance, Junction to ambient (note ) 151 oC/W *. Drain current is limited by junction temperature. 1. Gate 2. Drain 3. Source Order Codes Item Sales Type Marking Package Packaging 1 SW R 3406 3406 SOT-23 REEL N-channel Enhanced mode SOT-23 MOSFET Features High ruggedness Low R DS(ON) (Typ 46mΩ)@VGS=4.5V (Typ 34m Ω)@V GS=10V Low Gate Charge (Typ 8nC) Improved dv/dt Capability 100% Avalanche Tested Application:DC-DC Converter,Inverter, Synchronous Rectification General Description This power MOSFET is produced with advanced technology of SAMWIN. This technology enable the power MOSFET to have better characteristics, including fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. BV DSS : 30V I D : 4A R DS(ON) : 46mΩ@VGS=4.5V 34m Ω@V GS=10V 1 2 3 SOT-23 1 2 3 Note: R thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d efined as the solder mounting surface of the drain pins. R thjc is guaranteed by design while Rthca is determined by the user's board design. 151 oC/W on a 1 in2 pad of 2oz copper. |
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