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HT1629G Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HT1629G Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 23 page  Rev. 1.00 3 November 11, 2016 HT1629G COG Chip Dimensions Item Number Size Unit X Y Chip size — 9132 794 μm Chip thickness — 508±20 μm Bump spacing — 20 μm Bump pitch — 60 μm Bump size Output pad — 40 100 μm Input pad — 40 100 μm Dummy pad — 40 100 μm NC pad — 40 100 μm Bump height All pad 18±3 μm COG Alignment mark Dimensions Item Number Size Unit ALIGN_A 302 20μm 40μm 20μm 40μm μm ALIGN_B 151 20μm 40μm 20μm 20μm 20μm μm COG Pad Dimensions Item Number Size Unit Output pad — 60μm 40μm μm Input pad Dummy pad |
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