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HT7327-2 Datasheet(PDF) 9 Page - Holtek Semiconductor Inc |
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HT7327-2 Datasheet(HTML) 9 Page - Holtek Semiconductor Inc |
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9 / 16 page ![]() Rev. 1.00 9 August 26, 2015 HT73xx-2 Application Information Thedevicesarea3-terminallowdropoutseries linearvoltageregulators.Itisimportantthefollowing applicationpointsarenotedifcorrectoperationisto beachieved. External Circuit Itisimportantthatexternalcapacitorsareconnected toboththeinputandoutputpins.Fortheinputpin suitablebypasscapacitorsasshownintheapplication circuitsshouldbeconnectedespeciallyinsituations whereabatterypowersourceisusedwhichmayhave ahigherimpedence.Fortheoutputpin,asuitable capacitorshouldalsobeconnectedespeciallyin situationswheretheloadisofatransientnature,in whichcaselargercapacitorvaluesshouldbeselected tolimitanyoutputtransientvoltages. Thermal Considerations Themaximumpowerdissipationdependsonthe thermalresistanceoftheICpackage,thePCBlayout, therateofthesurroundingairflowandthedifference betweenthejunctionandambienttemperature.The maximumpowerdissipationcanbecalculatedbythe followingformula: PD(MAX)=(TJ(MAX)–Ta)/θJA whereTJ(MAX)isthemaximumjunctiontemperature, TaistheambienttemperatureandθJAisthejunction- to-ambientthermalresistanceoftheICpackagein degreesperwatt.ThefollowingtableshowstheθJA valuesforvariouspackagetypes. Package θJA value oC/W SOT89-3 200 oC/W TO-92 200 oC/W 8SOP-EP 125 oC/W For maximum operating rating conditions, the maximumjunctiontemperatureis150°C.However, it is recommended that the maximum junction temperaturedoesnotexceed125°Cduringnormal operationtomaintainanadequatemarginfordevice reliability.Thederatingcurvesofdifferentpackages formaximumpowerdissipationareasfollows: 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1.0 SOT89-3, TO-92 0 Ambient Temperature (oC) 8SOP-EP 0.8W 0.5W Power Dissipation Calculation Inordertokeepthedevicewithinitsoperatinglimits andtomaintainaregulatedoutputvoltage,thepower dissipationofthedevice,givenbyPD,mustnot exceedtheMaximumPowerDissipation,givenby PD(MAX).ThereforePD≤PD(MAX).Fromthediagramit canbeseenthatalmostallofthispowerisgenerated across the pass transistorwhich is actinglikea variableresistorinserieswiththeloadtokeepthe outputvoltageconstant.Thisgeneratedpowerwhich willappearasheat,mustneverallowthedeviceto exceeditsmaximumjunctiontemperature. Vref VIN GND OUT Vfb VIN Common VOUT IIN Common ILOAD Inpracticalapplicationstheregulatormaybecalled upon to provide both steady state and transient currents due to the transient nature of the load. Althoughthedevicemaybeworkingwellwithinits limitswithitssteadystatecurrent,caremustbetaken withtransientloadswhichmaycausethecurrentto riseclosetoitsmaximumcurrentvalue.Caremust betakenwithtransientloadsandcurrentsasthiswill resultindevicejunctiontemperatureriseswhichmust notexceedthemaximumjunctiontemperature.With bothsteadystateandtransientcurrents,theimportant currenttoconsideristheaverageormoreprecisely theRMScurrentwhichisthevalueofcurrentthatwill appearasheatgeneratedinthedevice.Thefollowing diagramshowshowtheaveragecurrentrelatestothe transientcurrents. Time ILOAD ILOAD(AVG) Asthequiescentcurrentofthedeviceisverysmallit cangenerallybeignoredandasaresulttheinputcur- rentcanbeassumedtobeequaltotheoutputcurrent. Thereforethepowerdissipationofthedevice,PD,can becalculatedasthevoltagedropacrosstheinputand outputmultipliedbythecurrent,givenbytheequation, PD=(VIN–VOUT)×IIN.Astheinputcurrentisalso equaltotheloadcurrentthepowerdissipationPD= (VIN–VOUT)×ILOAD.However,withtransientloadcur- rents,PD=(VIN–VOUT)×ILOAD(AVG)asshowninthe figure. |
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